MG ChemicalsThermal management
MG Chemicals TIA225GF
2K silicone gap filler
High-conductivity two-component silicone gap filler that cures to a putty consistency and conforms to the gap between component and cold plate.
Technical data
| Thermal conductivity | 2,5 W/(m·K) |
|---|---|
| Working time | 240 min |
| Mix ratio | 1:1 by volume |
| Service temperature | −45 a 200 °C |
| Mixed viscosity | 100 Pa·s |
Recommended for: by technology only
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