VitralitUV curing
Vitralit UD 5180
1K epoxy, UV + heat cure
UV/thermal encapsulant for soldered joints and connector solder points and for flexible conductors, with high adhesion to polyimide and low halogen content.
Technical data
| Viscosity | 4.000–6.000 mPa·s (Rheometer 10 s⁻¹); variant UD 5180 MV 6.000–11.000 |
|---|---|
| Cure | UV/heat |
| Service temperature | −40 a +200 °C |
| Hardness | Shore D 20–35 |
| Application | Encapsulado de uniones soldadas en cell contacting systems; encapsulado sobre flex; conectores |
Recommended for: UV-cure bonding
Need the technical data sheet (TDS) and safety data sheet (SDS)?
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Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.