Momentive
Momentive SilCool TIA200R
Thermal management
1K thermally conductive silicone, heat cure
Heat-curing, thermally conductive 1K silicone adhesive.
View technical data →Thermal management
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Momentive
Momentive SilCool TIA216G
Thermal management
2K thermally conductive silicone (encapsulant/TIM gel), addition cure
Thermally conductive 2K silicone encapsulant.
View technical data →Novasil
Novasil S 152
Silicone
2K potting silicone, alkoxy condensation
Fluid, white, thermally conductive two-component potting compound with V-0 flame rating according to the brochure.
View technical data →Novasil
Novasil S 825
Silicone
2K condensation potting silicone
White, thermally conductive, self-extinguishing two-component potting compound for electronics.
View technical data →Elecolit
Elecolit 6601
Thermal management
1K thermally conductive epoxy, heat cure
Thermally conductive adhesive/potting for bonding sensors and heat sinks, with excellent adhesion to metals, high strength and good flow.
View technical data →Elecolit
Elecolit 6603
Thermal management
1K thermally conductive epoxy, heat cure
Thermally conductive adhesive for sensors, heat sinks and magnets and automotive potting; highly resistant to vibration and thermal shock; UL94 HB.
View technical data →Elecolit
Elecolit 6604
Thermal management
1K thermally conductive epoxy, heat cure
Thermally conductive adhesive for bonding magnets and heat sinks, with excellent adhesion to metals.
View technical data →Elecolit
Elecolit 6608
Thermal management
1K thermally conductive epoxy, heat cure
Thermally conductive potting for high temperature (automotive), with low CTE, high Tg (140 °C), UL94 V-0, good dielectric properties and thermal shock resistance.
View technical data →MG Chemicals
MG Chemicals 8618
Thermal management
Silicone-free thermal paste
Very high conductivity silicone-free thermal paste.
View technical data →MG Chemicals
MG Chemicals 8327GL3
Thermal management
1K silicone-free thermal gel, non-curing
One-component silicone-free thermally conductive gel for form-in-place application; non-curing, low modulus, reworkable and UL94 V-0.
View technical data →MG Chemicals
MG Chemicals 8327GL5
Thermal management
1K silicone-free thermal gel, non-curing
One-component silicone-free form-in-place thermally conductive gel, high conductivity and UL94 V-0.
View technical data →MG Chemicals
MG Chemicals 8327GL6
Thermal management
1K silicone-free thermal gel, non-curing
One-component silicone-free form-in-place thermally conductive gel, very high conductivity and UL94 V-0.
View technical data →MG Chemicals
MG Chemicals 860
Thermal management
Silicone thermal paste
One-component silicone thermal paste that does not bond permanently, allowing rework.
View technical data →MG Chemicals
MG Chemicals 8616
Thermal management
Silicone-free thermal paste
One-component silicone-free oil-based thermal paste.
View technical data →MG Chemicals
MG Chemicals 8618
Thermal management
Silicone-free thermal paste
Very high conductivity silicone-free thermal paste.
View technical data →MG Chemicals
MG Chemicals 8329TFF
Thermal management
2K thermally conductive epoxy, electrically insulating, flame-retardant
Very fast-setting fluid thermally conductive epoxy adhesive for bonding LED boards or battery modules to heat sinks; UL94 V-0 certified.
View technical data →MG Chemicals
MG Chemicals 8329TFS
Thermal management
2K thermally conductive epoxy
Thermally conductive epoxy adhesive with long working time.
View technical data →MG Chemicals
MG Chemicals 8329TCM
Thermal management
2K thermally conductive epoxy paste
Thixotropic thermally conductive epoxy paste adhesive, suitable for vertical surfaces.
View technical data →MG Chemicals
MG Chemicals 8329TCS
Thermal management
2K thermally conductive epoxy paste, low outgassing
Long-working-time thermally conductive epoxy paste adhesive with low outgassing per ASTM E595, for thermal management in satellites.
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