MomentiveThermal management
Momentive TSE3280G
1K thermally conductive silicone, heat cure
Heat-curing grey thermally conductive silicone adhesive for heat dissipation in electronics.
Technical data
| Viscosity | 60.000 mPa·s |
|---|---|
| Cure | 100 °C/2 h; 125 °C/45 min; 150 °C/30 min |
| Thermal conductivity | 0,88 W/m·K |
| Hardness | Shore A 62 |
| Tensile strength | 3,3 MPa |
| Shear strength | 2,0 MPa |
| Dielectric strength | 21 kV/mm |
| Service temperature | −55 a +200 °C |
Recommended for: by technology only
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Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.