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Structalit 8838

1K epoxy, heat cure

Low-Tg flexible epoxy curing at low temperature for potting sensitive components and glob top; jettable, flux-compatible and resistant to temperature and humidity changes.

Technical data
Viscosity6.500–7.500 mPa·s
Cure5 min/150 °C; 30 min/80 °C
Tg (DSC)15–25 °C
Service temperature−40 a +200 °C

Recommended for: Electronics protection

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