StructalitEpoxy for electronics
Structalit 5606 F
Epoxy, heat cure, fluorescent
Fast, low-temperature curing SMD adhesive, easy to dispense, screen-printable and suitable for pin transfer.
Technical data
| Viscosity | 22.000–30.000 mPa·s |
|---|---|
| Cure | 7 min/150 °C; 55 min/100 °C |
| Service temperature | −40 a +180 °C |
| Hardness | Shore D 67 |
Recommended for: Electronics protection
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Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.