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Structalit 5604

1K epoxy, heat cure

Fast-curing red SMD adhesive, resistant to soldering temperatures, for protecting and fixing components.

Technical data
Viscosity25.000–40.000 mPa·s (Rheometer 10 s⁻¹)
Cure4 min/150 °C; 50 min/100 °C
Service temperature−40 a +180 °C
Solder resistanceup to 270 °C (max. 5 min)
HardnessShore D 75–90
ColourRed

Recommended for: Electronics protection

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