StructalitEpoxy for electronics
Structalit 3060-1
1K epoxy, heat cure
Very flexible, very fast-curing one-component epoxy for fixing and protecting SMD components, flexible electronics, wafer level bonding, encapsulation and lens bonding.
Technical data
| Viscosity | 4.000–8.000 mPa·s |
|---|---|
| Cure | <1 min/180 °C; 5 min/120 °C |
| Service temperature | −40 a +180 °C |
| Hardness | Shore D 40–60 |
Recommended for: Electronics protection
Need the technical data sheet (TDS) and safety data sheet (SDS)?
Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.
Send us your enquiry and we will send you the latest versions, together with a technical expert's recommendation.